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4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YZR pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, Analog Devices KS-4, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sc70ks/ks_4.pdf Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted socket strip THT 2x30 1.00mm double row Through hole pin header THT 1x07 1.00mm single row style2 pin1 right Through hole angled pin header, 2x03, 1.27mm pitch, double rows Through hole angled pin header, 2x12, 2.54mm pitch, 8.51mm socket length, single row Through hole angled pin header SMD 2x23 2.54mm double row Through hole socket strip THT 2x34 2.00mm double row Through hole Samtec HPM power header series 3.81mm post length, 1x02, 5.08mm pitch, single row (from Kicad 4.0.7!), script generated Through hole angled pin header, 1x30, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole straight pin header, 1x40, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x03 1.00mm single row style2 pin1 right Through hole pin header THT 2x10 2.54mm double row Through hole angled pin header THT 2x28 2.00mm double row Through hole straight socket strip, 1x06, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x35, 2.00mm pitch, double rows Through hole Samtec HPM power header series 3.81mm post length THT 1x05 1.00mm single row Through hole angled pin header, 2x18, 2.54mm pitch, 8.51mm socket length, double cols (https://gct.co/files/drawings/bc085.pdf.

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