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56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 20 leads; body width 7.5 mm; (see NXP sot054_po.pdf TO-92 leads molded, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 14 leads; body width 4.4 mm; Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (https://www.nxp.com/docs/en/data-sheet/PCF8523.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py eSIP-7C Vertical Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations K Package PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body (see Atmel Appnote 8826 64-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments EUS 5 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AB), generated with kicad-footprint-generator connector JAE side entry boss JST XA series connector, S26B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 504050-0591 (http://www.molex.com/pdm_docs/sd/5040500891_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2111, 11 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 3.5, Wuerth electronics 9771070360 (https://katalog.we-online.com/em/datasheet/9771070360.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 64 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT2232H.pdf#page=57), generated with kicad-footprint-generator JST PUD series connector, BM11B-ZESS-TBT (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator LED SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin, RGY0020A (https://www.ti.com/lit/ds/symlink/txb0108.pdf#page=33 Texas RSE0010A UQFN, 10 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0429.PDF), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 8, Wuerth electronics 9774080951 (https://katalog.we-online.de/em/datasheet/9774080951.pdf), generated with kicad-footprint-generator JST GH series connector, 14111113001xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13001XXX_100228421DRW046C.pdf), generated with kicad-footprint-generator Hirose DF63 vertical Hirose DF11 through hole, DF13-14P-1.25DS, 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 1 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP I, 28 pins, surface mount PLCC, 84 pins, surface mount PLCC, 28 pins, surface mount SMD Kemet EC2 signal relay DPDT double coil latching through hole 3.3mm, height.

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