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For: MC_1,5/5-G-3.5; number of pins: 11; pin pitch: 5.00mm; Angled; threaded flange || order number: 1776605 12A || order number: 1806261 12A 630V Generic Phoenix Contact connector footprint for: MSTBA_2,5/14-G; number of pins: 02; pin pitch: 3.50mm; Vertical; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1776731 12A || order number: 1836257 8A 320V Generic Phoenix Contact connector footprint for: MC_1,5/16-GF-3.5; number of pins: 16; pin pitch: 5.08mm; Vertical || order number: 1847505 8A 320V Generic Phoenix Contact connector footprint for: MC_1,5/3-GF-3.81; number of pins: 08; pin pitch: 3.81mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1827868 8A 160V Generic Phoenix Contact connector footprint for: MSTB_2,5/8-GF; number of pins: 08; pin pitch: 7.62mm; Angled; threaded flange || order number: 1847615 8A 320V Generic Phoenix Contact connector footprint for: MSTBV_2,5/8-GF; number of pins: 05; pin pitch: 7.50mm; Vertical || order number: 1827871 8A 160V Generic Phoenix Contact connector footprint for: MSTB_2,5/10-GF; number of pins: 05; pin pitch: 5.00mm; Angled; threaded flange || order number: 1843923 8A 160V Generic Phoenix Contact SPT 2.5/4-H-5.0-EX Terminal Block, 1990821 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1990821), generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/dac80508.pdf Analog LFCSP, 16 Pin (http://www.ti.com/lit/ds/sbos354a/sbos354a.pdf, JEDEC MO-220 variation VGGC), generated with.

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