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SSOP 3.9 4.9 1.00 SSOP14: plastic shrink small outline package; 48 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 14 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 10 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf SSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/drv8801.pdf#page=31 MO-220 variation VGGC), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 2.5 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 36 Pin (JEDEC MO-153 Var HA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 3, Wuerth electronics 9774035243 (https://katalog.we-online.de/em/datasheet/9774035243.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, 64800711622 (https://katalog.we-online.com/em/datasheet/6480xx11622.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 48 Pin (http://www.st.com/resource/en/datasheet/stm32f042k6.pdf#page=94), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 3.5, Wuerth electronics 9774080360 (https://katalog.we-online.de/em/datasheet/9774080360.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 16.

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