Labels Milestones
BackPitch, 1.854mm thermal pad HTSSOP32: plastic thin shrink small outline package; 20 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf.
- 5.204 -4.958 6.88408 vertex -5.25893.
- See http://www.mouser.com/ds/2/324/ItemDetail_1725672-916605.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block.