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AE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py DE Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0136.PDF (T1633-5), https://pdfserv.maximintegrated.com/land_patterns/90-0032.PDF), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 09-65-2028, 2 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated.

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