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Trim($rel); Final work on PCB 398c2b234c Checkpoint after re-centering sliders, before removing redundant LED resistors next to transistors to wide

find the assembly notes - C1: enlarge footprint; a box film cap for 100v is smaller, but not that small - C7 is a ceramic 104 power cap like C5, C6, C8, C9 D1, D2, D3, D4, D5, D8, D9, D10 | 8 pin SIM connector for PCB's with 30 contacts (not polarized Highspeed card edge connector for PCB's with 70 contacts (not polarized Highspeed card edge connector for PCB's with 05 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 60 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 50 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 50 contacts (polarized Highspeed card edge connector for PCB's with 60 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 50 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 30 contacts (not polarized Highspeed card edge card connector socket for 2.36mm PCBs, vertical, alignment pins (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 4.618x4.142mm package, pitch 0.65mm UFBGA-32, 6x6, 4x4mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f091vb.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f302vc.pdf WLCSP-100, 10x10 raster, 10x10mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f071v8.pdf WLCSP-63, 7x9 raster, 3.228x4.164mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 484 0.8.

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