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BackB09B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py mlf 8 2x2 mm 16-Lead Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm 8-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 6-lead surface-mounted (SMD) DIP package, row spacing.
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