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6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to the recipient; and b. Under Patent Claims infringed by Covered Software is furnished to do so, subject to the greatest extent permissible under.

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