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Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A Zynq-7000 BGA, 15x15 grid, 13x13mm package, pitch 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf.

• 0.0570715 -0.187549 0.980596 vertex.
• Normal 8.051843e-01 0.000000e+00 5.930246e-01 facet normal -0.367478.
• 8.014610e-14 -1.000000e+00 3.659659e-14 facet normal.

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