Labels Milestones
BackThermally Enhanced Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD.
- -0.555899 0.83125 4.94372e-08 vertex 2.40319 -2.4343 6.59.
- 4.114986e+000 2.357309e+000 2.488918e+001 facet.
- See http://www.farnell.com/datasheets/5793.pdf Power Integration Y.
- We sometimes make exceptions.