3
1
Back

37mm diameter 20mm Electrolytic Capacitor CP, Axial series, Axial, Vertical, pin pitch=2.54mm, , length*diameter=7*3.3mm^2, Fastron, MICC, http://www.fastrongroup.com/image-show/70/MICC.pdf?type=Complete-DataSheet&productType=series Inductor Axial series Axial Horizontal pin pitch 20mm length 17mm diameter 6mm Resistor, Axial_DIN0617 series, Axial, Horizontal, pin pitch=10.16mm, , length*diameter=3.2*2.6mm^2, , http://www.diodes.com/_files/packages/T-1.pdf Diode T-1 series Axial Vertical pin pitch 5.08mm size 66x11.2mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00053, 10 pins, pitch 10mm, size 82.3x14mm^2, drill diamater 1.3mm, pad diameter 2.7mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.25 mm² wires, basic insulation, conductor diameter 2mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for 2 times 1.5 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Quectel BG96 Cellular GSM 2G Module https://www.quectel.com/download/quectel_bg96_hardware_design_v1-4 Quectel BG96 Cellular GSM 2G Module https://www.quectel.com/download/quectel_bg96_hardware_design_v1-4 Quectel BG96 Cellular GSM 2G Module L-band satellite communication module, https://docs.astrocast.com/dl/0532-DOC-M2M-ASTRO-Astronode_S-Datasheet.pdf RF module Astrocast radio Astronode 2.4 GHz Bluetooth ble zigbee 802.15.4 flash crypto ATSAMR21G18 AT45DB041E TECC508A U.Fi Class 4 Bluetooth Module with on-board components hard_sync traces added but maybe won't keep traces_before_hard_sync Fix for component clearance, panel thickness from printer realities Compare 4 commits » created pull request 'new_footprints' (#5) from new_footprints into main Reviewed-on: https://gitea.circuitlocution.com/synth_mages/MK_VCO/pulls/4 Put title box in PDF export 45cf8c00cd Merge pull request 'Finish schematic, add PDF' (#2) from schematic into main created pull request 'More schematics' (#3) from schematic by Eeschema 5.1.9-73d0e3b20d~88~ubuntu20.04.1 Generated from schematic into main ... Add jlc constraints DRC; replace order number text Fireball/Fireball_panel.kicad_pcb | 3 | 1k | Resistor | | | | | | | | | | | R14 | 1 Hardware/lib/aoKicad | 1 | Conn_01x07 | *(optional) SIP socket, 2.54 mm, 1x7 | .

New Pull Request