Labels Milestones
BackToyocom FA-238 series https://support.epson.biz/td/api/doc_check.php?dl=brief_fa-238v_en.pdf, hand-soldering, 3.2x2.5mm^2 package crystal Ceramic Resin Sealed SMD http://www.foxonline.com/pdfs/fe.pdf, hand-soldering, 7.5x5.0mm^2 package crystal Epson Toyocom FA-238 series http://www.mouser.com/ds/2/137/1721499-465440.pdf, hand-soldering, 3.2x2.5mm^2 package crystal Epson Toyocom FA-238 series http://www.mouser.com/ds/2/137/1721499-465440.pdf, hand-soldering, 3.2x2.5mm^2 package crystal Epson.
- Neosid, SD75, http://www.neosid.de/produktblaetter/neosid_Festinduktivitaet_Sd75.pdf Inductor Radial series.
- Enlarge footprint if needed.
- For: MCV_1,5/8-G-5.08; number of pins: 04; pin.
- GSM 2G Module https://www.quectel.com/download/quectel_bg96_hardware_design_v1-4.