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Wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA.

• Square, SMD Pad, 5mm.
• (id 17a7121e-b68e-480a-a63e-d9064ffac0d1 Latest commits for file Schematics/SynthMages.pretty/POT_2_PIN_Header.kicad_mod.
• 0.502121 -0.307708 0.808202 facet normal.

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