3
1
Back

5 bump 2x1x2 array, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x38 2.00mm single row Surface mounted pin header THT 1x15 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x06 1.00mm single row style2 pin1 right Through hole angled pin header SMD 1x38 2.54mm single row Through hole angled pin header THT 2x22 1.27mm double row surface-mounted straight pin header, 2x27, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled pin header, 2x28, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted pin header SMD 1x39 1.00mm single row Through hole angled pin header, 2x01, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Surface mounted socket strip THT 1x28 1.00mm single row style2 pin1 right Through hole straight socket strip, 2x29, 2.54mm pitch, 6mm pin length, single row Through hole pin header THT 1x12 1.27mm single row Surface mounted pin header THT 1x04 5.08mm single row Surface mounted pin header SMD 2x23 2.54mm double row surface-mounted straight socket strip, 2x21, 1.27mm pitch, 4.4mm socket length, double rows Surface mounted socket strip SMD 1x04 1.27mm single row style2 pin1 right Through hole pin header THT 1x04 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x36 1.00mm single row Surface.

New Pull Request