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LFCSP VQ, 48 pin, exposed pad: 4.5x8.1mm, with thermal vias in pads, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 72-Lead Frame Chip Scale Package - 9x9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [DFN] (see Microchip Packaging.

Href="https://gitea.circuitlocution.com/synth_mages/MK_VCO/commit/c852e5d6ad8630143a633f6c4ffcb4d705a43337" rel="nofollow">c852e5d6ad8630143a633f6c4ffcb4d705a43337 Add note.
7.9152 facet normal -4.225930e-02 -6.191634e-03 -9.990875e-01 facet.
SPST KingTek_DSHP04TJ, Slide, row spacing 15.24 mm.
0.29028 0.956942 0 facet.

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