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TO-3 TO3 TO-204 TO-3P-3, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-5, Vertical, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 0.97mm Multiwatt-9 staggered type-1 TO-220-7 Vertical RM 1.7mm IIPAK I2PAK TO-264-2, Horizontal, RM 2.54mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-2 Horizontal RM 5.08mm TO-220F-3, Horizontal, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Horizontal RM 5.08mm TO-220-3, Horizontal, RM 5.08mm, see https://www.centralsemi.com/PDFS/CASE/TO-220-2PD.PDF TO-220-2 Horizontal RM 2.54mm TO-220F-4, Vertical, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-9 Vertical RM 2.29mm IPAK TO-262-3, Horizontal, RM 1.7mm, Pentawatt, Multiwatt-5, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421_straight_lead.pdf TO-220-5 Horizontal RM 1.7mm PentawattF- MultiwattF-5 TO-220F-5, Vertical, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220F-9, Vertical, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Horizontal RM 2.54mm TO-247-5, Horizontal, RM 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF diode bridge Vishay KBL rectifier diode bridge SMD diode bridge Thermal enhanced ultra thin fine pitch quad flat package (http://www.st.com/resource/en/datasheet/stm8s003f3.pdf ST UQFN 6 pin 0.5mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat Pack, 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments EUK 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), SMDSocket, SmallPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 6x-dip-switch SPST CTS_Series194-6MSTN, Piano, row spacing 7.62 mm (300 mils), LongPads 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 6.7x14.26mm (see.

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