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LongPads 18-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 32-lead though-hole mounted DIP package, row spacing 7.62.

• 8-note. Expanding out to 8 (or 10?) Breadboard.
• Diameter=35.1mm, Vishay, TJ6, http://www.vishay.com/docs/34079/tj.pdf L_Toroid Vertical series.
• { Initial stab at a 10-step panel.

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