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Fuse, TE5, Littelfuse/Wickmann, No. 460, No560, https://www.littelfuse.com/~/media/electronics/datasheets/fuse_holders/littelfuse_fuse_holder_559_560_datasheet.pdf.pdf Fuse Fuseholder ATO Blade littelfuse Pudenz 2 Pin (https://www.bourns.com/data/global/pdfs/TBU-CA.pdf), generated with kicad-footprint-generator JST ACH series connector, SM12B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py AMS OLGA, 8 Pin (https://media-www.micron.com/-/media/client/global/documents/products/data-sheet/nor-flash/serial-nor/mt25q/die-rev-a/mt25q_qljs_u_256_aba_0.pdf#page=22), generated with kicad-footprint-generator Mounting Hardware, inside through hole PLCC, 28 pins, 18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf TSOP I 32 reverse TSOP-I, 40 Pin (http://www.ti.com/lit/ds/symlink/msp430g2755.pdf#page=70 JEDEC MO-220 variation VJJD-2), generated with kicad-footprint-generator Fuse SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://www.vishay.com/docs/20019/rcwe.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-3210, 32 Pins (http://www.molex.com/pdm_docs/sd/5024301410_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, LY20-16P-DLT1, 8 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator connector Molex PicoBlade series connector, 504050-0891 (http://www.molex.com/pdm_docs/sd/5040500891_sd.pdf), generated with kicad-footprint-generator JST PH series connector, 502386-1070 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Ultra Thin Plastic Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flat, No Lead Package - 4x4x0.9 mm Body [TSSOP] with exposed pad 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B07B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48 Pin (JEDEC MO-153 Var JC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST GH series connector, SM22B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-123-02-xxx-DV-BE-A, 23 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4130, 13 Pins per.

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