Labels Milestones
BackST WLCSP-156, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 26x26 grid.
- 2.091 -1.04 (end 2.371 2.329.
- Http://www.onsemi.com/pub/Collateral/QRE1113-D.PDF PhotoDiode, plastic SMD DIL, 4.5x4mm, area.
- Bourns TBU-CA Fuse, 2 Pin fuse.
- As low as 2v could works as.
- L-band patch antenna, https://docs.astrocast.com/dl/0534-DOC-M2M-ASTRO-Patch_Antenna-Datasheet.pdf L-band antenna astrocast.