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Pin (http://www.ti.com/lit/an/scea032/scea032.pdf#page=4), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0810, with PCB locator, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 40 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BC), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 36 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/36L_QFN_6x6_with_3_7x3_7_EP_Punch_Dimpled_4E_C04-0241A.pdf), generated with kicad-footprint-generator connector wire 2sqmm strain-relief Soldered wire connection with feed through strain relief, for 5 times 0.127 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 2mm, outer diameter 4.4mm, size.

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