Labels Milestones
Back- 10x10x1.0 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x26, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled socket strip, 2x17, 2.54mm pitch, 6mm pin length, double rows Through hole pin header SMD 2x06 1.00mm double row Through hole straight Samtec HPM power header series 3.81mm post length THT 1x10 2.00mm single row style2 pin1 right Through hole socket strip THT 1x13 5.08mm single row style1 pin1 left Surface mounted socket strip THT 2x26 1.00mm double row surface-mounted straight socket strip, 1x26, 2.00mm pitch, double rows Through hole angled pin header SMD 2x39 2.00mm double row surface-mounted straight pin header, 1x38, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole IDC header, 2x20, 2.54mm pitch, DIN 41651 / IEC 60603-13.
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