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WSON-10 package 2x3mm body, pitch 0.5mm, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf TSOP-I, 24 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/(UH24)%20QFN%2005-08-1747%20Rev%20A.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, B11B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-148 .

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