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Http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YBJ0008.

• -0.353597 0.430898 0.830239 facet normal -9.428339e-01 -3.440546e-03.
• 6.38504 3.82299 facet normal.
• SMD 7x-dip-switch SPST Omron_A6S-710x, Slide, row spacing 25.4.
• Step - reset Pots, 3-pin: Glide attenuator (B10k.

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