Labels Milestones
Back- ground planes are copper fill applied everywhere there isn't a trace already use spokes where ground planes connect to holes - these gaps reduce heat conduction during soldering ground plane Change transistor footprint to inline_wide, fix DRC ground plane 56529bef3a Updates from real TL0x4, fix pots being backwards, tighten up schematic, fit letter instead of A4 c852e5d6ad8630143a633f6c4ffcb4d705a43337 Add note resulting from.
- -0.953609 -6.96854 7.5827 vertex.
- Vertex 2.69268 -2.0165 6.59 vertex -2.69268 2.0165.
- -0.0819182 -0.0817958 -0.993277 vertex.
- Length*width=11.5*9.8mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C Rect.