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Body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf TSOP I 32 reverse TSOP-I, 40 Pin (http://www.ti.com/lit/ds/symlink/msp430g2755.pdf#page=70.

• WLCSP-81, ST die ID.
• Modular Case/DSC03764.JPG Executable file View File 3D.
• 0.808203 vertex 3.64093 -1.48976 19.1916.
• -0.0989687 0.995063 vertex -0.50268 7.98986.

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