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600mil 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket.

(Bluetooth Smart) 21 Pin Module Digi XBee.
166.5 127 (end 164.745 127.005 (end 168.85.
202396-1007 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 128.
XP_POWER IHxxxxD DIP DCDC-Converter XP_POWER IAxxxxS, SIP, (https://www.xppower.com/pdfs/SF_IA.pdf.

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