Labels Milestones
Back5050 5.0mm x 5.0mm PLCC4 LED 4.7mm x 1.5mm PLCC6 LED, http://www.cree.com/led-components/media/documents/1381-QLS6AFKW.pdf Cree XHP50, 6V footprint, http://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/Data%20and%20Binning/ds%20XHP50.pdf Cree XHP50, 12V footprint, http://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/Data%20and%20Binning/ds%20XHP50.pdf Cree XHP50, 12V footprint, http://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/Data%20and%20Binning/ds%20XHP50.pdf Cree XHP50, 12V footprint, http://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/Data%20and%20Binning/ds%20XHP50.pdf Cree XHP50, 12V footprint, http://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/Data%20and%20Binning/ds%20XHP50.pdf Cree XHP70 LED, 12V version, http://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/Data%20and%20Binning/ds%20XHP70.pdf Cree XHP70 LED, 6V version, http://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/Data%20and%20Binning/ds%20XHP70.pdf Cree XHP70 LED, 12V version, http://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/Data%20and%20Binning/ds%20XHP70.pdf LED Cree-XQ handsoldering pads http://www.cree.com/~/media/Files/Cree/LED-Components-and-Modules/XLamp/Data-and-Binning/ds-XQB.pdf LED SMD 3mm Right Angle Low-profile vertical USB Micro-B receptacle, through-hole, vertical, http://katalog.we-online.de/em/datasheet/614105150721.pdf usb micro receptacle vertical Hirose series connector, 505405-0870 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 72 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001682C.pdf#page=70), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact Style, 33 Circuits (http://www.molex.com/pdm_docs/sd/5022441530_sd.pdf molex FFC/FPC connector Pitch 0.5mm VSSOP DCU R-PDSO-G8 Pitch0.5mm VSSOP-8 3.0 x 3.0, http://www.ti.com/lit/ds/symlink/lm75b.pdf VSSOP-8 3.0 x 2.0mm, orientation marker at cathode, https://dammedia.osram.info/media/resource/hires/osram-dam-25688470/SFH%202201%20A01_EN.pdf PhotoDiode, plastic SMD DIL, 4.5x4mm² PhotoDiode plastic DIL RM5.08 PhotoTransistor, sidelooker package, RM2.54 PhotoTransistor sidelooker package RM2.54 package for Everlight ITR8307/F43, see https://everlighteurope.com/index.php?controller=attachment&id_attachment=5385 package for diode bridges, row spacing 10.16 mm (400 mils 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 10x-dip-switch SPST Copal_CHS-10B, Slide, row spacing 15.24 mm (600 mils), Socket 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 7.62 mm (300 mils), body size 10.8x32.04mm 12x-dip-switch SPST CTS_Series194-12MSTN, Piano, row spacing 7.62 mm (300 mils), Socket 18-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 2x-dip-switch SPST Omron_A6S-210x, Slide, row spacing 10.16 mm (400 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP Switch SPST Slide 6.73mm 264mil SMD LowProfile.
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