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Normal -8.401793e-02 9.964642e-01 0.000000e+00 facet normal 6.820989e-01 7.312599e-01 1.425847e-04 vertex -1.024349e+02 1.040225e+02 4.255000e+01 facet normal 0.081929 -0.133699 0.98763 vertex 4.54757 0.203118 18.7299 facet normal -0.831538 0.555468 5.74269e-08 facet normal -0.976223 -0.0962896 0.194209 facet normal -0.956942 0.288323 0.0336345 facet normal -0.463913 0.883082 -0.070359 vertex 9.83901 1.66324 0.0388355 facet normal 0.300167 -0.365756 0.880978 vertex 5.89328 5.89328 5.74921 facet normal 0.828666 -0.0815498 0.55377 facet normal -0.995182 0.0973807 0.0114129 vertex -1.05954 7.19679 7.81812 facet normal 0.114971 -8.78678e-05 0.993369 facet normal -0.0819182 0.0817958 -0.993277 vertex -2.97557 -4.24331 21.7998 facet normal -0.0846387 0.279018 0.956549 facet normal 0.0376247 0.382437 0.923215 facet normal -9.581206e-01 -2.863638e-01 -8.203024e-04 vertex -1.042160e+02 1.011513e+02 2.550000e+00 facet normal -1.011997e-14 5.429241e-15 -1.000000e+00 d8eca8dc7e Go to file db7d02719b Find and replace last few thin traces, fix teardrops and gnd fill Embiggen traces, add teardrops updated C5 footprint & tracing; schematic annotation 2cbdb94ba94f485ce4abcb1f14e2e5f15d016647 updates the potentiometer pads and trace routing to de-bodge the pots. Updates the potentiometer pads and trace routing to de-bodge the pots. Updates the potentiometer pads and thermal vias; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32f042k6.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.5mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, VQFN-HR RNN0018A (http://www.ti.com/lit/ds/symlink/tps568215.pdf QFN, 16 Pin (https://www.diodes.com/assets/Datasheets/PAM8403.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 1.5 mm² wire, basic insulation, conductor diameter 1.4mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2.5 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/cc1101.pdf#page=101), generated with kicad-footprint-generator Molex SPOX Connector System, 43045-2221 (alternative finishes: 43045-040x), 2 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 2.5 mm² wires, basic insulation, conductor diameter.

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