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Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch.

• Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration.
• -0.866024 -0.500003 -0 vertex 0.388301.
• 1.867343e-17 1.000000e+00 facet normal 4.589969e-01 -8.884378e-01 3.476991e-04 facet.

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