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Https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 483, 3.73x4.15mm, 115 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901.

• -1.2151 18.7502 facet normal -0.938724 0.284757.
• -2.360004e-15 -8.103531e-16 -1.000000e+00 facet normal 4.323866e-002 7.566777e-002.

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