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5 bump 2x1x2 array, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole straight pin header, 1x39, 2.00mm pitch, double rows Surface mounted socket strip SMD 2x09 2.00mm double row Through hole angled pin header THT 2x20 2.00mm double row Through hole angled pin header THT 2x29 2.00mm double row Through hole straight pin header, 1x05, 1.00mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole socket strip SMD 2x13 1.00mm double row surface-mounted straight pin header, 2x16, 2.54mm pitch, single row.

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