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3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments BGA-289, 0.4mm pad, based on the left sub-panel top_row = height - v_margin; working_increment = working_height / 6; // generally-useful spacing amount for vertical columns of stuff col_left = h_margin; col_right = width_mm - col_right; // column from edge plus hole radius // elevated sockets to fit in glide controls More mounting hole 4.3mm m4 din965 Mounting Hole 5.3mm, M5, DIN965 mounting hole 5.3mm no annular Mounting Hole 4.3mm, no annular, M2.5, DIN965 mounting hole 2.2mm m2 iso14580 Mounting Hole 6.4mm, M6, ISO14580 mounting hole 6mm no annular Mounting Hole 4.3mm, no annular, M4, DIN965 mounting hole position tweaks More mounting hole 6.4mm m6 iso7380 Mounting Hole 5.3mm, no annular, M4 mounting screws (https://www.vishay.com/docs/95423/sot227g2.pdf, https://www.vishay.com/docs/95793/vs-fc420sa10.pdf TR TO-3 TO3 TO-204 TO-3P-3, Horizontal, RM 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 1.27mm Multiwatt-7 staggered type-2 TO-220-7, Vertical, RM 0.9mm, staggered type-2 TO-220-15, Vertical, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Horizontal RM 5.08mm TO-126-3, Horizontal, RM 1.27mm, staggered type-2, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 5.08mm TO-126-2, Vertical, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Vertical RM 5.08mm TO-126-2, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-2, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 0.97mm Multiwatt-9 staggered type-2 TO-220F-4, Vertical, RM 1.7mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Vertical RM 2.54mm IIPAK I2PAK TO-264-2, Horizontal, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Horizontal RM 0.97mm Multiwatt-9 staggered type-2.

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