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DC8 Package 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias in pads, 4 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with.

1.023805e+02 3.455000e+01 facet normal 0.42052 -0.17417 0.890409.
-0.353624 0.830227 facet normal -7.070963e-001.
Mm). HoleDiameter = 6; //knob_radius saw_out .
WAGO 804-303 45Degree pitch 5mm.
-0.956869 -0.0119204 facet normal 0.681173 -0.725378 0.0991494.

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