3
1
Back

Https://www.switchcraft.com/Drawings/RAPC10U_CD.pdf barreljack switchcraftconxall dc power Wuerth electronics 9774010951 (https://katalog.we-online.de/em/datasheet/9774010951.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 46007-1105, 5 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator JST PHD series connector, S15B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Inductor SMD 1806 (4516 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.vishay.com/docs/20056/crcw01005e3.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-114-02-xx-DV-PE-LC, 14 Pins per row (http://www.molex.com/pdm_docs/sd/1053141208_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0410, with PCB locator, 15 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-lead plastic dual flat, 2x3x0.75mm size, 0.5mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MN_C04-0129E-MN.pdf TDFN, 8 Pin (http://ww1.microchip.com/downloads/en/devicedoc/20005514a.pdf#page=35), generated with kicad-footprint-generator Mounting Hardware, inside through hole THT Kemet EC2 signal relay DPDT double dual coil latching surface mount SMD package for diode bridges, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead dip package, row spacing 7.62 mm (300 mils 14-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 5x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 5.08 mm (200 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD DIP DIL PDIP 2.54mm 7.62mm 300mil Three phase, Bridge, Rectifier 4-lead round diode bridge Single phase bridge rectifier case 19x19mm, pitch 12.7mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/pb1000.pdf Single phase bridge rectifier case KBPC6, see http://www.vishay.com/docs/93585/vs-kbpc1series.pdf Single phase bridge rectifier case 15.1x15.1mm, pitch 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Horizontal RM 2.286mm SIPAK Horizontal RM 0.97mm Multiwatt-9 staggered type-1 TO-220-9 Vertical RM 2.54mm staggered type-1 TO-220-11, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 2.29mm IPAK TO-262-3, Horizontal, RM 1.7mm, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 1.27mm MultiwattF-15 staggered type-2 TO-220-9 Horizontal RM 1.27mm staggered type-2 TO-220F-7, Vertical, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Horizontal RM 2.54mm TO-220-4.

New Pull Request