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22x22 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf USON-10 2.5x1.0mm_ Pitch 0.5mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm 8-Lead Plastic DFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 24-Lead Plastic QFN (2mm x 2mm) 0.40mm pitch DDB Package; 10-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [UDFN] (see Atmel-8815-SEEPROM-AT24CS01-02-Datasheet.pdf DFN, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf#page=68), generated with kicad-footprint-generator connector JST PH series.

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