Labels Milestones
BackFBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA.
- HLE-149-02-xxx-DV, 49 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated.
- 2.0mm THT pad as test Point, diameter 4.0mm.
- Diffed from for ideal BSP.
- / CASCADE out Period: 1 month 1 day.
- Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001725D.pdf (Page 9)), generated with kicad-footprint-generator.