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Package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted pin header SMD 1x13 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x18 2.00mm double row surface-mounted straight socket strip, 2x15, 1.00mm pitch, 2.0mm pin length, single row style2 pin1 right Through hole pin header THT 1x07 5.08mm single row Surface mounted pin header SMD 1x38 1.27mm single row Surface mounted pin header SMD 1x14 1.27mm single row Through hole socket strip SMD 2x05 2.54mm double row Through hole angled socket strip, 1x03, 2.00mm pitch, 4.2mm pin length, single row Through hole angled socket strip, 2x04, 2.00mm pitch, 4.2mm pin length, double rows Through hole IDC header, 2x08, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole pin header THT 1x15 5.08mm single row Through hole straight pin header, 1x40, 1.00mm pitch, 2.0mm pin length, single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x21 2.00mm single row Through hole pin header THT 2x16 1.27mm double row surface-mounted straight socket strip, 2x28, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package.

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