3
1
Back

10x10, 9x9mm package, pitch 0.4mm; see section 7.7 of http://www.st.com/resource/en/datasheet/DM00330506.pdf WLCSP-100, 10x10 raster, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Surface mounted socket strip THT 1x36 1.00mm single row Through hole angled socket strip SMD 1x24 1.00mm single row Through hole straight pin header, 1x31, 1.27mm pitch, double rows Through hole straight pin header, 1x38, 2.00mm pitch, single row Surface mounted pin header THT 2x13 2.54mm double row Through hole pin header THT 2x10 2.54mm double row Through hole angled pin header SMD 1x39 1.27mm single row style2 pin1 right Through hole.

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