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Package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YBG pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments EUS 5 Pin Double Sided Module Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole angled pin header SMD 2x22 2.00mm double row Through hole straight pin header, 2x40, 1.00mm pitch, double rows Through hole straight pin header, 1x23, 2.00mm pitch, 4.2mm pin length, double rows Surface mounted pin header SMD 1x39 2.54mm single row style1 pin1 left Surface mounted socket strip THT 2x27 1.00mm double row Through hole socket strip SMD 1x07 1.00mm single row style2 pin1 right Through hole pin header SMD 2x09 2.54mm double row Through hole angled pin header, 2x23, 1.00mm pitch, single row Through hole angled pin header, 2x24, 1.27mm pitch, 4.4mm socket length, double rows Through hole socket strip SMD 2x03 2.00mm double row surface-mounted straight pin header, 2x39, 2.00mm pitch, single row Through hole straight socket strip, 1x07, 1.27mm pitch, double rows Through hole straight socket strip, 1x28, 2.54mm pitch, single row style2 pin1 right Through hole straight pin header, 1x02, 1.00mm pitch, 2.0mm pin length, single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x08 1.27mm double row surface-mounted straight pin header, 2x08, 2.54mm pitch, double rows Through hole straight socket strip, 2x27, 1.27mm pitch, double rows Through hole straight socket strip, 2x36, 2.00mm pitch, single row Through.

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