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Plastic PSOP, Exposed Die Pad (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf MLF, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-100172.PDF), generated with kicad-footprint-generator Soldered wire connection, for 4 times 1.5 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 3.5mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 8.6, Wuerth electronics 9774140360.

3.051 -1.04 (end 3.131 1.785 (end 3.131.
1923830 16A (HC Generic.
9.725134e+01 1.146144e+01 vertex -1.056995e+02.

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