3
1
Back

SOIC-8, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments LM25119 http://www.ti.com/lit/ds/symlink/lm25119.pdf WQFN, 42 Pin (http://www.ti.com/lit/ds/symlink/ts3l501e.pdf#page=23), generated with kicad-footprint-generator Hirose series connector, LY20-18P-DLT1, 9 Circuits (https://www.molex.com/pdm_docs/sd/2005280090_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1430, 14 Pins per row (http://www.molex.com/pdm_docs/sd/439151404_sd.pdf), generated with kicad-footprint-generator Hirose DF63 vertical Hirose DF13 through hole, DF63R-2P-3.96DSA, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0050, 5 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective.

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