3
1
Back

RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 0.97mm Multiwatt-9 staggered type-1 TO-220F-7 Vertical RM 1.27mm staggered type-2 TO-220-11, Vertical, RM 1.7mm, staggered type-1, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Horizontal RM 5.475mm SOT-93 TO-220-2, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Horizontal RM 1.7mm MultiwattF-11 staggered type-2 TO-220-9 Vertical RM 10.9mm TO-264-3, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-7 Horizontal RM 5.45mm TO-264-3, Vertical, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Horizontal RM 1.27mm staggered type-1 TO-220F-15, Vertical, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Horizontal RM 1.27mm Multiwatt-7 staggered type-2 TO-220-4 Vertical RM 2.29mm IPAK TO-251-3, Horizontal, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Horizontal RM 2.54mm TO-220-4, Horizontal, RM 5.08mm, see https://www.centralsemi.com/PDFS/CASE/TO-220-2PD.PDF TO-220-2 Horizontal RM 0.97mm Multiwatt-9 staggered type-1 TO-220F-2, Horizontal, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Vertical RM 1.7mm staggered type-2 TO-220F-9, Vertical, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Horizontal RM 5.45mm TO-3P-3, Vertical, RM 5.08mm, see http://www.vishay.com/docs/88769/woo5g.pdf diode bridge Single phase bridge rectifier case KBPC1, see http://www.vishay.com/docs/93585/vs-kbpc1series.pdf Single phase bridge rectifier case KBPC1, see http://www.vishay.com/docs/93585/vs-kbpc1series.pdf Vishay KBM rectifier diode bridge DFS, see http://www.vishay.com/docs/88854/padlayouts.pdf TO-269AA MBS diode bridge Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias in pads, 2 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B18B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas X2QFN, 12 Pin (https://www.renesas.com/us/en/document/psc/package-drawing-tdfn-12pin-l123x3c), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.25 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 1.7mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for 6 times 1.5 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 2mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST LEA series.

New Pull Request