Labels Milestones
BackClear milestone No items Clear projects No project Assignees Clear assignees No Assignees 1 Participants Notifications Subscribe Due Date The licenses granted in Section 10.3, no one other thing: There has not been any commit activity in this period. 1 Unresolved Conversation # Temporary files *.000 *.bak *.bck *.kicad_pcb-bak *.kicad_sch-bak *-backups *.kicad_prl *.sch-bak *~ _autosave-* *.tmp *-save.pro *-save.kicad_pcb fp-info-cache *.lck # KiCad backups folders temp_* # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes count 16 Not plated through holes are merged with plated holes unplated through holes: ============================================================= 2bd01a1ff2d30ca3cff647bbf3b80645437cc07c start 531ebcae92ad8ad00635060e3583259ee13cc12b 4675f71e05fc19d3608ee6e5061bbe79ae432fb7 c4e1c30b9b Add jlc constraints DRC; replace order number text 613d1b6f7ef8de710893bbeb40d56c8d26d50247 New Pull Request