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Strip, 1x06, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header THT 2x04 2.54mm double row Through hole angled pin header, 1x17, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip THT 1x33 1.27mm single row Surface mounted socket strip THT 2x01 2.54mm double row surface-mounted straight pin header, 2x09, 1.27mm pitch, 4.4mm socket length, double rows Through hole pin header SMD 1x24 1.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole angled pin header THT 2x29 2.54mm double row Through hole socket strip THT 1x08 2.00mm single row style2 pin1 right Through hole angled pin header, 1x39, 2.00mm pitch, double rows Surface mounted pin header SMD 1x12 2.00mm single row Surface mounted socket strip SMD 1x15 1.00mm single row Through hole angled socket strip THT 2x36 1.27mm double row surface-mounted straight pin header, 2x12, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x08, 1.27mm pitch, 4.4mm socket length, double rows Through hole angled pin header SMD 2x14 1.00mm double row SMD IDC box header 2x20 2.54mm double row Through hole pin header SMD 2x38 1.27mm double row surface-mounted straight pin header, 2x37, 1.27mm pitch, double rows Surface mounted pin header THT 1x18 2.54mm single row style2 pin1 right Through hole angled socket strip, 1x16, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x06, 2.00mm pitch, single row Surface mounted pin header THT 2x21 2.54mm double row Through hole straight pin header, 1x22, 2.00mm pitch, double rows Surface mounted pin header SMD 2x12 1.27mm double row surface-mounted straight socket strip, 2x15, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A Zynq-7000 BGA, 15x15 grid, 13x13mm package, pitch 0.5mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf WLCSP-143, 11x13 raster, 4.539x5.849mm package, pitch 0.65mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-49.

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