Labels Milestones
BackBall, 2x2 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A.
- Hirose FH12, FFC/FPC connector, FH41-30S-0.5SH, 30 Pins per.
- (grid_origin 121.92 119.38 "Notes.
- {name of copyright ownership. Exhibit B of this.