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BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x29 1.27mm double row SMD IDC box header THT 2x08 2.00mm double row Through hole angled pin header THT 2x21 2.00mm double row surface-mounted straight socket strip, 2x05, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 2x20 2.54mm double row Through hole pin header THT 2x18 2.54mm double row Through hole pin header THT 1x33 2.00mm single row Through hole horizontal IDC header triangle being so far out Fix annoyance of 2x05 IDC header THT 2x17 1.27mm double row surface-mounted straight pin header, 2x17, 2.54mm pitch, single row style2 pin1 right Through hole angled socket strip, 2x25, 2.54mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled socket.

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