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VCF.png create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/DIP-8_W7.62mm_Socket_LongPads.kicad_mod create mode 100644 Hardware/Panel/precadsr_panel_al/sym-lib-table create mode 100644 Panels/a_color_icon_of_a_flying_fireball.webp create mode 100644 Images/IMG_6777.JPG MK_VCO/Fireball/Fireball VCO saw wave core.circuitjs.txt Normal file Unescape panelThickness = 2; // plastic walls are 2mm clf_shaft_diameter = 6.3; // the main module. It calls the submodules. // smoothing = true; set_screw_radius = 1.5; // How much horizontal space needed for left-hand and right-hand sub-panels left_panel_width = 12*3 + tolerance*2; //three knobs plus space between two resistors Properly assign potentiometer pads and thermal vias; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1 MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wl54jc.pdf ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (ST)-4.4 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Small Outline Narrow Body (QR)-.150" Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 20 Pin (https://www.holtek.com/documents/10179/116723/sop20-300.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 2 mm² wires, reinforced insulation, conductor diameter 0.48mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector JST SH side entry Molex Mini-Fit Sr.

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