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(http://ww1.microchip.com/downloads/en/DeviceDoc/00001725D.pdf (Page 9)), generated with kicad-footprint-generator ipc_gullwing_generator.py FE Package; 16-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 4x-dip-switch SPST , Slide, row spacing 5.9 mm (232 mils), body size 10.8x4.1mm DIP Switch SPST Slide 7.62mm 300mil 8-lead dip package, row spacing 7.62 mm (300 mils), body size 10.8x19.34mm 7x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 18-pin zero insertion force socket, through-hole, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP Switch SPST Slide 5.25mm 206mil JPin SMD 4x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300.

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