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Connector, BM04B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-24S-0.5SH, 24 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator JST EH series connector, S14B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B14B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Resistor SMD 01005 (0402 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://datasheets.avx.com/schottky.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 2x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 22-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 32-lead dip package, row spacing 8.61 mm (338 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 4x-dip-switch SPST , Piano, row spacing 9.53 mm (375 mils), Clearance8mm 14-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD Sub-miniature slide switch, EG series, SPDT, https://www.e-switch.com/wp-content/uploads/2022/06/EG.pdf tactile switch, 7.3mm x 6.25mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf WLCSP-66, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf Lattice caBGA-381 footprint for ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, BGA Microstar.

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